Inventor · Taoyuan, TW

Chien-Wei Chang

39Patents
5h-index
49Co-inventors
69Inventor score

Filing activity: Apr 15, 2003 → Nov 18, 2023

Most-cited inventions

PatentTitleAreaCited byStatus
US8173401B2 Method for direct amplification from crude nucleic acid samples Chemistry; Metallurgy 42 Active
US6759318B1 Translation pad flip chip (TPFC) method for improving micro bump pitch IC substrate structure and manufacturing process Electricity 13 Expired
US8460934B2 Method for direct amplification from crude nucleic acid samples Chemistry; Metallurgy 12 Active
US6969674B2 Structure and method for fine pitch flip chip substrate Electricity 8 Expired
US7598580B1 Image sensor module package structure with supporting element Electricity 6 Active
US7875809B2 Method of fabricating board having high density core layer and structure thereof Emerging Cross-Sectional Technologies 5 Active
US8051558B2 Manufacturing method of the embedded passive device Emerging Cross-Sectional Technologies 4 Active
US8377815B2 Manufacturing method of a semiconductor load board Electricity 2 Active
US9088761B2 Image recording system, image recorder, and data accessing method Electricity 2 Active
US8409806B2 Allelic ladder loci Chemistry; Metallurgy 2 Active
US8083954B2 Method for fabricating component-embedded printed circuit board Emerging Cross-Sectional Technologies 2 Active
US11901183B2 Fin field-effect transistor device and method of forming the same Electricity 1 Active
US9184331B2 Method for reducing tilt of optical unit during manufacture of image sensor Electricity 1 Active
US8004602B2 Image sensor structure and integrated lens module thereof Electricity 1 Active
US8153401B2 Method for direct amplification from crude nucleic acid samples Chemistry; Metallurgy 1 Active
US7871892B2 Method for fabricating buried capacitor structure Electricity 1 Active
US8312624B1 Method for manufacturing a heat dissipation structure of a printed circuit board Emerging Cross-Sectional Technologies 1 Active
US11851325B2 Methods for wafer bonding Performing Operations; Transporting 1 Active
US11189604B2 Device assembly structure and method of manufacturing the same Electricity 0 Active
US7573721B2 Embedded passive device structure and manufacturing method thereof Emerging Cross-Sectional Technologies 0 Active
US8186054B2 Method of fabricating board having high density core layer and structure thereof Emerging Cross-Sectional Technologies 0 Active
US9200479B2 Continuous panel frame with hanging arm Chemistry; Metallurgy 0 Active
US11267099B2 Chemical mechanical planarization membrane Electricity 0 Active
US7525242B2 Lamp clamping and electrically connecting device Electricity 0 Active
US8450137B2 Method for reducing tilt of transparent window during manufacturing of image sensor Electricity 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.