Integrated circuit having antenna proximity lines coupled to the semiconductor substrate contacts
US6969902B2 · kind B2 · utility
0Cited by
4References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 21, 2003 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Mar 21, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An embodiment of the invention is an integrated circuit 2 having antenna proximity lines 3 coupled to the semiconductor substrate 5. Another embodiment of the invention is a method of manufacturing an integrated circuit 2 having antenna proximity lines 3 coupled to the semiconductor substrate 5.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.