Method and apparatus for measuring thin film, and thin film deposition system
US6970532B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 9, 2001 |
| Grant date | Nov 29, 2005 |
| Priority date | — |
| Expiry date | Jul 7, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01B15/02
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
The thin film deposition system for depositing a thin film on the surface of substrates disposed in a sealed thin film deposition furnace comprises a measuring unit at a site communicating with the thin film deposition furnace, the measuring unit comprising a thin film deposition sample substrate for allowing a thin film substance flowing in from the thin film deposition furnace to adhere while X-ray incidence and extraction windows being provided on the side walls of the measuring unit, wherein X-ray is irradiated on the thin film deposition sample substrate in the measuring unit through the X-ray incidence window by means of a thin film measuring unit provided at the outside of the thin film deposition furnace, and the X-ray reflected from the thin film deposition sample substrate is sensed through the X-ray extraction window.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.