Methods of treating physical vapor deposition targets
US6971151B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Apr 22, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31678
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention encompasses a method of treating a physical vapor deposition target. The target has a sputtering surface and a sidewall edge at a periphery of the sputtering surface. The method comprises pressing a tool against the sidewall edge to form a distribution of imprints in the sidewall edge of the target. The tool is then removed from the sidewall edge, leaving the imprints extending into the sidewall edge. The invention also encompasses a physical vapor deposition target. The target includes a sputtering surface having an outer periphery, and a sidewall edge along the outer periphery of the sputtering surface. The sidewall edge has a repeating pattern of imprints extending therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.