Jane Buehler
10Patents
6h-index
8Co-inventors
51Inventor score
Filing activity: Jun 2, 1999 → Jun 30, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6113761A | Copper sputtering target assembly and method of making same | Chemistry; Metallurgy | 32 | Expired |
| US7687112B2 | Surface for reduced friction and wear and method of making the same | Emerging Cross-Sectional Technologies | 23 | Active |
| US6503380B1 | Physical vapor target constructions | Emerging Cross-Sectional Technologies | 14 | Expired |
| US6849139B2 | Methods of forming copper-containing sputtering targets | Emerging Cross-Sectional Technologies | 10 | Expired |
| US6331234A | Copper sputtering target assembly and method of making same | Chemistry; Metallurgy | 8 | Expired |
| US6758920B2 | Conductive integrated circuit metal alloy interconnections, electroplating anodes; metal alloys for use as a conductive interconnection in an integrated circuit; and physical vapor deposition targets | Electricity | 6 | Expired |
| US6797079B2 | Physical vapor deposition target | Electricity | 6 | Expired |
| US6858102B1 | Copper-containing sputtering targets, and methods of forming copper-containing sputtering targets | Emerging Cross-Sectional Technologies | 5 | Expired |
| US6645427B1 | Copper sputtering target assembly and method of making same | Chemistry; Metallurgy | 5 | Expired |
| US6971151B2 | Methods of treating physical vapor deposition targets | Emerging Cross-Sectional Technologies | 2 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.