Method and control system for improving CMP process by detecting and reacting to harmonic oscillation
US6971944B2 · kind B2 · utility
1Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 17, 2004 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Feb 17, 2024 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B49/10
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or eliminating harmonic oscillation, films with reduced structure strengths including low k dielectric films can be used. By countering the noise, the quality of the work environment is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.