Patent · US Expired

Device and method for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

US6972069B2 · kind B2 · utility

8Cited by

11References

8Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Franz Hecht · Bernhardswald, DE
Werner Kroninger · Neutraubling, DE
Melanie Lutzke · Ingolstadt, DE

Key dates

Filing date	Mar 31, 2003
Grant date	Dec 6, 2005
Priority date	—
Expiry date	Jan 11, 2024

Classification

Technology area (CPC H)Electricity
CPC primaryH01L21/6838
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.