Dual magnetron sputtering apparatus utilizing control means for delivering balanced power
US6972079B2 · kind B2 · utility
5Cited by
2References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 25, 2003 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Nov 7, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3405
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
There is disclosed a dual magnetron sputtering apparatus that is comprised of a balancing circuit connected to the output of an ac power source that supplies ac power to at least two target materials such that the balancing circuit allows the power supply to deliver equal power to each target material. In those applications where there may be an erosion of one target material faster than the other, the balancing circuit allows the power supply to deliberately unbalance the power to at least one of the target materials to reduce power to the target to compensate for faster erosion of the target.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.