Method of manufacturing and testing a semiconductor device
US6972202B2 · kind B2 · utility
6Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 3, 2003 |
| Grant date | Dec 6, 2005 |
| Priority date | — |
| Expiry date | Oct 24, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method of testing a semiconductor device includes the steps of: positioning on a surface of a test jig a semiconductor wafer provided with the semiconductor device; dividing the semiconductor wafer into a plurality of semiconductor chips on the surface by dicing the semiconductor wafer; and, with the plurality of semiconductor chips positioned on the surface, testing an electrical characteristic of semiconductor device.Consequently, a method of testing a semiconductor device which can test an electrical characteristic with higher accuracy prior to an assembling step, can be provided.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.