Inclined solder wave methodology for wave soldering double sided pin-in-hole electronic components
US6974071B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 18, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Mar 20, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/304
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
An apparatus for applying solder to an electronic circuit board substrate includes a solder wave device for generating a molten wave of solder and, above that, a movable substrate holder. The substrate holder includes a support for an electronic circuit board substrate inclined at an angle with respect to the direction and an opening on a bottom thereof for access of a protruding connector disposed near an end of the substrate to the molten solder wave. The angle of incline is sufficient to prevent a component disposed at a distance from the end of the substrate from contacting the molten solder wave when the substrate holder is moved over the solder wave device. A shield in the substrate holder prevents the component not to be soldered from contacting the molten solder wave.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.