Patent · US Expired

Ceramic substrate and method of manufacturing same

US6974515B2 · kind B2 · utility

2Cited by
4References
3Claims
0Family size

Assignee

Inventors

Key dates

Filing dateJan 27, 2003
Grant dateDec 13, 2005
Priority date
Expiry dateMay 1, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH05K2201/09018
  • WIPO fieldAudio-visual technology
  • WIPO sectorElectrical engineering

Abstract

A ceramic substrate having a defined curvature and a method of its manufacture are described. For this purpose at least two ceramic layers having different defined temperature coefficients of expansion are positioned on top of one another and are permanently bonded together. A curved ceramic substrate may be advantageously utilized in micro-hybrid technology, in multilayer ceramic technology, or in hybrid technology, e.g., as a membrane element of a piezoresistive pressure sensor element.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.