Method of forming a solder ball using a thermally stable resinous protective layer
US6974659B2 · kind B2 · utility
8Cited by
2References
19Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2002 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Mar 5, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method for protecting a semiconductor process wafer surface from contacting thermally degraded photoresist including providing a semiconductor process wafer having a process surface; forming a protective layer over selected areas of the process surface said protective layer including a resinous organic material having a glass transition temperature (Tg) that is about greater than a thermal treatment temperature; forming a photoresist layer over at least a portion of the protective layer to include a photolithographic patterning process; and subjecting the semiconductor process wafer to the thermal treatment temperature.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.