Method to sputter deposit metal on a ferroelectric polymer
US6974984B2 · kind B2 · utility
1Cited by
3References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 31, 2003 |
| Grant date | Dec 13, 2005 |
| Priority date | — |
| Expiry date | Jan 9, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10D1/682
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Methods of depositing various metal layers adjacent to a ferroelectric polymer layer are disclosed. In one embodiment, a collimator may be used during a sputtering process to filter out charged particles from the material that may be deposited as a metal layer. In various embodiments, a metal layer may contain at least one of an intermetallic layer, an amorphous intermetallic layer, and an amorphized intermetallic layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.