Patent · US Expired

Integrated VCSELs on traditional VLSI packaging

US6975514B2 · kind B2 · utility

7Cited by
7References
23Claims
0Family size

Assignee

Inventor

Key dates

Filing dateJan 31, 2003
Grant dateDec 13, 2005
Priority date—
Expiry dateJan 31, 2023

Classification

  • Technology area (CPC H)Electricity
  • CPC primaryH01S5/02325
  • WIPO fieldOptics
  • WIPO sectorInstruments

Abstract

A circuit module including at least one Application Specific Integrated Circuit (ASIC) and a plurality of Vertical Cavity Surface-Emitting Laser (VCSEL) array modules is built using a standard ceramic or organic VLSI package substrate, resulting is a high density device with a small footprint. Interconnection between the electronic devices and the VCSEL array modules is accomplished using standard integrated circuit packaging technology and flexible connectors. Optical connections from the VCSEL arrays to fiber optic cables are made possible by integrating industry-standard optical connectors onto the package. Optical receiver and transceiver modules may also be incorporated into the circuit module.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.