Resin encapsulation molding method of electronic part and resin encapsulation molding apparatus used therefor
US6977188B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Aug 15, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Nov 4, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01033
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
First, an intermediate plate and a lower mold are clamped. Thus, a release film is sandwiched between a mold surface of the intermediate plate and a mold surface of the lower mold. In this state, the clamping of an upper mold and the intermediate plate begins. Thus, an enclosed space is formed. Thereafter, the enclosed space is forcibly evacuated. At this time, the upper mold and the intermediate plate is gradually clamped. As a result, the enclosed space is filled with a molten resin and the resin encapsulation mold is completed. According to this method, the release film is prevented from moving into the enclosed space. Thus, deformation or severing of a wire is avoided when the resin encapsulation molding is performed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.