High density laminated substrate structure and manufacture method thereof
US6977348B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 12, 2002 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Apr 10, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A laminated substrate structure composed of a plurality of dielectric layers and a plurality of circuit layers stacked with each other. Each of the dielectric layers has a plurality of via studs, and the circuit layers are electrically coupled with each other through the via studs. The laminated substrate structure of the present invention is characterized by adopting the embedded structure landless design that provides high reliability and better adherence. The present invention also provides a laminated substrate manufacture method. The dielectric layers having the patterned circuit and the dielectric layers having the via holes are formed first, and after the dielectric layers having the patterned circuit and the dielectric layers having the via holes are formed, they are aligned and laminated synchronously to complete the manufacture of the laminated substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.