Shaped sputter shields for improved ion column operation
US6977384B2 · kind B2 · utility
1Cited by
2References
25Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 23, 2003 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Nov 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J2237/31749
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The invention adds one or more surface contour(s) to the bombarded area(s) within ion columns to greatly reduce the likelihood that back sputtered material will reach the ion generating source. A number of different surface contours are disclosed including angled surfaces, surfaces defining cups to capture back sputtered material, pre-textured and forested surfaces. The different surfaces can be used in any combination. The reduction in back sputtered material reaching the ion source reduces the time to stability, greatly increases the working stability, and increases the lifespan of the source.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.