Solid-state image pickup apparatus limiting adhesive intrusion
US6977686B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Mar 7, 2001 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Apr 25, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/19043
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A solid-state image pickup apparatus includes a solid-state image pickup device having a layer of microlenses above a color filter. The solid-state image pickup device is mounted on a side of a flexible printed circuit board by flip-chip bonding, opposite the opening. An adhesive in a gap between the solid-state image pickup device and the flexible printed circuit board strengthens the apparatus. The distance between the edge of the microlens layer and the edge of the flexible printed circuit board defining the opening and nearest to the microlens layer is 2.5 to 10 times wider than the gap between the solid-state image pickup device and the flexible printed circuit board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.