Wiring pattern and method of manufacturing the same and thin film magnetic head and method of manufacturing the same
US6977796B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Feb 8, 2002 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | Jul 16, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49064
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A bottom track pole is formed on a surface of a bottom pole, a thin film coil is formed on the bottom pole to form a flat coplanar surface with the bottom track pole, a write gap film is formed on the flat coplanar surface, first and second magnetic material films constituting a top pole are formed on a flat surface of the thin film coil, and the second magnetic material film, first magnetic material film, write gap film and bottom track pole are partially removed by RIE to form a top track pole and trim structure in a self-aligned manner. The thin film coil is formed by a first thin film coil half and a second thin film coil half having coil windings which are formed in a self-aligned manner between successive coil windings of the first thin film coil half and have a two-layer structure of a first conductive film at least a part of which is formed by CVD and a second conductive film formed by electrolytic plating. A thin insulating film is interposed between successive coil windings of the first and second thin film coil halves. Jumper wirings for connecting an innermost coil winding of the first thin film coil half to an outermost coil winding of the second thin film coil half ar…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.