Method and apparatus for placement of vias
US6978433B1 · kind B1 · utility
7Cited by
1References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 16, 2002 |
| Grant date | Dec 20, 2005 |
| Priority date | — |
| Expiry date | May 22, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/394
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
Method and apparatus for placement of vias is described. More particularly, source power and ground vias are placed in partial response to locations where conductive lines cross over a reserved region. The reserved region is reserved for an embedded device, and is reserved in a layout database of a host device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.