Apparatus and methods to enhance thermal energy transfer in IC handler systems
US6978541B1 · kind B1 · utility
7Cited by
4References
24Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 1, 2002 |
| Grant date | Dec 27, 2005 |
| Priority date | — |
| Expiry date | May 26, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Disclosed is apparatus to enhance thermal energy transfer from a heater to a DUT in IC handler systems. The pick-up head of an IC handler system is made of metal blocks in maximal thermal contact, and further includes an electrically resistive and thermally conductive layer. The electrically resistive layer provides ESD protection to the DUT. The preferred apparatus uses a collapsible billows suction cup to secure, pick-up, and align DUTs.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.