Wafer handling system
US6981832B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 15, 2003 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Mar 4, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/67781
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A system for processing semiconductor wafers includes adaptations allowing the selective handling of cassettes for both 200-mm wafers and 300-mm wafers. The system is configured initially for handling standard 300-mm FOUP cassettes. Adaptions for handling 200-mm wafer open cassettes include a load port adapter frame for receiving such cassettes on a input/output platform; a cassette handler adapter configured for reversibly mounting on a cassette handler end effector and for receiving 200-mm open cassettes; a store adapter frame for converting 300-mm FOUP storage compartments into compartments for storing 200-mm open cassettes; and a Transhipment FOUP for holding 200-mm open cassettes upon a cassette transfer platform and bringing such cassettes into an interface with a wafer handler. The Transhipment FOUP has outer surfaces resembling a standard 300-mm FOUP cassette, but is configured to receive a 200-mm open cassette therein.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.