Method and apparatus to establish circuit layers interconnections
US6982387B2 · kind B2 · utility
1Cited by
20References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 19, 2001 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Jun 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10416
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method and associated structure for forming a conductive path within a laminate. A conductive element is presses into an opening in the laminate such that portion of at least one end of the conductive element extends beyond a surface of the laminate. A compressive pressure is applied to the portion of the at least one end of the conductive element. The compressive pressure applied to the at least one end of the conductive element forms a contact pad extending beyond the surface of the laminate. The conductive element may include an inner element covered by an outer element.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.