Semiconductor device having a plurality of laminated semiconductor elements with water absorbing resin films interposed therebetween
US6982489B2 · kind B2 · utility
3Cited by
2References
2Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 2, 2003 |
| Grant date | Jan 3, 2006 |
| Priority date | — |
| Expiry date | Sep 15, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device has a plurality of laminated semiconductor elements 2, and highly water-absorbing resin films 3 formed between the semiconductor elements. Here, the highly water-absorbing resin films 3 preferably contain water or a low-boiling-point organic solvent. Alternatively, the highly water-absorbing resin films may contain, or may be allowed to contain after packaging, an organic solvent having a boiling point equal to or higher than the reflow temperature of solder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.