Thermal transfer measurement of an integrated circuit
US6984064B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Jul 31, 2002 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Aug 18, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01K7/425
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system and method may be utilized to thermally characterize a live integrated circuit device. The system and method can determine the thermal transfer function of the device by analyzing environment temperature, and the temperature of the integrated circuit die over a time period. The time period can be between the removal of power to the device and a time when a thermal equilibrium is reached or between other changes in power parameters provided to the device. The thermal characteristics can be utilized in a feed forward algorithm for controlling temperature of the integrated circuit device and to determine interface integrity.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.