Exposure method and apparatus
US6984472B2 · kind B2 · utility
0Cited by
8References
6Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 26, 2001 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Nov 4, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/70941
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
An unwanted deposited film is removed from the surface of a photomask in which a desired pattern has been formed. Then, a resist film is exposed to extreme ultraviolet radiation through the photomask, from which the deposited film has been removed, thereby transferring the desired pattern onto the resist film.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.