Semiconductor device
US6984889B2 · kind B2 · utility
Assignee
Inventor
Key dates
| Filing date | Apr 19, 2004 |
| Grant date | Jan 10, 2006 |
| Priority date | — |
| Expiry date | Apr 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1056
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The semiconductor device according to the present invention is equipped with a plurality of electronic circuits including at least one semiconductor integrated circuit chip, and a plurality of intermediate substrates interposed between the electronic components and a package and mounting the electronic components directly on its one major face, where each of the electronic component has on the one major face at least a plurality of first electrodes connected to the electronic components, a plurality of second electrodes for external connection, and internal connection electrodes for connecting between the electronic components including the connection between the first electrodes and the second electrodes that are mutually corresponding.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.