Methods and apparatus for particle reduction in MEMS devices
US6987304B2 · kind B2 · utility
5Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 7, 2003 |
| Grant date | Jan 17, 2006 |
| Priority date | — |
| Expiry date | May 7, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01P1/023
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method for assembling a micro-electromechanical system (MEMS) device that includes a micro-machine is described. The method comprises forming the micro-machine on a die, the die having a top surface and a bottom surface, providing a plurality of die bonding pedestals on a surface of a housing, and mounting at least one of the top surface of the die and components of the micro-machine to the die bonding pedestals such that a bottom surface of the die at least partially shields components of the micro-machine from loose gettering material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.