Method of assembling an interconnect device assembly
US6988310B2 · kind B2 · utility
3Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 28, 2002 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Mar 16, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49222
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method of assembling an interconnect device assembly which consists of cylindrical resilient wire bundles captured within a carrier. In a step of the method, the interconnect device assembly is placed in a fixture and the ends of the resilient wire bundles are deformed by shaping dies in the fixture so that the resilient wire bundles now have a dog bone shape. The dog bone shape of the resilient wire bundles prevents the resilient wire bundles from being partially or totally dislodged during handling and transit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.