Techniques for manufacturing flash-free contacts on a semiconductor package
US6989122B1 · kind B1 · utility
58Cited by
7References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 17, 2002 |
| Grant date | Jan 24, 2006 |
| Priority date | — |
| Expiry date | Jul 31, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldOther special machines
- WIPO sectorMechanical engineering
Abstract
Techniques for forming packaged semiconductor devices having top surfaces with flash-free electrical contact surfaces are described. According to one aspect, a molding cavity is provided which has a molding surface that is sufficiently smooth such that when placed in contact with an electrically conductive contact, gaps between the conductive contact and the mold cavity surface do not form.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.