Process for manufacturing multilayer flexible wiring boards
US6991148B2 · kind B2 · utility
2Cited by
18References
17Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Apr 28, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Oct 29, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49155
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The resin film is adapted to form an opening when the bump is forced into the resin film and an ultrasonic wave is applied to the bump. The bump is left in the opening to electrically connect the top of the bump to the first wiring layer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.