Patent · US Expired

Controlling resist profiles through substrate modification

US6991893B2 · kind B2 · utility

7Cited by

7References

22Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Michael Goodner · Hillsboro, US
Robert Meagley · Emeryville, US
Michael J. Leeson · Portland, US

Key dates

Filing date	Oct 31, 2002
Grant date	Jan 31, 2006
Priority date	—
Expiry date	Jul 28, 2023

Classification

Technology area (CPC G)Physics
CPC primaryG03F7/095
WIPO fieldOptics
WIPO sectorInstruments

Abstract

Photoresists may be formed over a structure that has been modified so as to poison a lower layer of the photoresist. Then, when the photoresist is patterned, it is only patterned down to the poisoned layer. The poisoned layer may be removed subsequently. However, because of the use of the modification process, the critical dimensions of the photoresist may be improved in some embodiments.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.