Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors
US6992374B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jun 14, 2004 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Jun 14, 2024 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board structure, vias supported by the non-conductive material, top pads electrically coupled to the vias, and bottom pads electrically coupled to the vias. The top pads are disposed along the top surface of the circuit board structure and are soldered to IC device. The bottom pads are disposed along the bottom surface of the circuit board structure and are configured to solder to the discrete components. The bottom pads include a group of angled bottom pads which is soldered to a group of the discrete components substantially at 45 degree angles relative to sides of the IC device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.