All-metal three-dimensional circuits and memories
US6992919B2 · kind B2 · utility
13Cited by
42References
43Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 8, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Dec 24, 2023 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11C11/15
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A three-dimensional circuit and methods for fabricating such a circuit are described. The three-dimensional circuit includes a plurality of stacked levels on a substrate. Each level includes a plurality of all-metal circuit components exhibiting giant magnetoresistance and arranged in two dimensions, the circuit further includes an interconnect for providing interconnections between the circuit components on different ones of the plurality of levels.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.