Method, structure, and computer program product for implementing high frequency return current paths within electronic packages
US6993739B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 9, 2003 |
| Grant date | Jan 31, 2006 |
| Priority date | — |
| Expiry date | Jul 12, 2024 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F30/367
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A method, structure and computer program product are provided for implementing high frequency return current paths within electronic packages. Electronic package physical design data is received for identifying a design layout. For each of a plurality of cells in a grid of a set cell size within the identified design layout, a respective number of signal vias, reference voltage vias, and ground vias are identified. A signal to reference via ratio is calculated for each of the plurality of cells. Each cell having a calculated signal to reference via ratio greater than a target ratio is identified. Vias are selectively added within each of the identified cells for providing high frequency return current paths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.