Silicon-containing polymer, resist composition and patterning process
US6994945B2 · kind B2 · utility
3Cited by
11References
37Claims
0Family size
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Key dates
| Filing date | Mar 1, 2002 |
| Grant date | Feb 7, 2006 |
| Priority date | — |
| Expiry date | Nov 3, 2022 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S430/115
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel silicon-containing polymers are obtained by copolymerizing a vinylsilane monomer with a compound having a low electron density unsaturated bond such as maleic anhydride, maleimide derivatives or tetrafluoroethylene. Using the polymers, chemical amplification positive resist compositions sensitive to high-energy radiation and having a high sensitivity and resolution at a wavelength of less than 300 nm and improved resistance to oxygen plasma etching are obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.