Method and system for monitoring and profiling an integrated circuit die temperature
US6996491B2 · kind B2 · utility
21Cited by
40References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 19, 2002 |
| Grant date | Feb 7, 2006 |
| Priority date | — |
| Expiry date | Dec 25, 2022 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06F1/206
- WIPO fieldComputer technology
- WIPO sectorElectrical engineering
Abstract
A system and method are provided for sensing a physical stimulus of an integrated circuit. The system and method operate with one or more active thermal sensors embedded in the die of an integrated circuit to provide highly accurate die temperature measurements. The system and method are able to monitor and control the die temperature of the integrated circuit to avoid an integrated circuit malfunction due to an undesirable temperature condition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.