Wafer planarization composition and method of use
US6997785B1 · kind B1 · utility
3Cited by
23References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 23, 2004 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Dec 23, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/31053
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.