Porous materials
US6998148B1 · kind B1 · utility
5Cited by
23References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 26, 2002 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Nov 27, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/09701
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containing such porous thermoset dielectric material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.