Polishing pad with oriented pore structure
US6998166B2 · kind B2 · utility
32Cited by
12References
16Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 17, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Jun 17, 2023 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31591
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a polishing pad for chemical-mechanical polishing comprising a body, a polishing surface, and a plurality of elongated pores, wherein about 10% or more of the elongated pores have an aspect ratio of about 3:1 or greater and are substantially oriented in a direction that is coplanar with the polishing surface. The invention further provides a method of polishing a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.