Circuit element having a first layer composed of an electrically insulating substrate material, a method for producing a circuit element, bispyridinium compounds and their use in circuit elements

US6998637B2 · kind B2 · utility

Assignee

• Infineon Technologies AG · DE

Inventors

• R. Luyken · Birkenfeld, DE
• Markus Seitz · Birkenfeld, DE
• Jon Andrew Preece · Birmingham, GB
• Werner Weber · Munich, DE
• Günter Schmid · Hemhofen, DE

Key dates

• Filing date: Jun 19, 2003
• Grant date: Feb 14, 2006
• Expiry date: Jun 24, 2024

Classification

• Technology area (CPC H): Electricity
• CPC primary: H10K19/00
• WIPO field: Computer technology
• WIPO sector: Electrical engineering

Abstract

The circuit element has a first layer composed of an electrically insulating substrate material and a first electrically conductive material which is in the form of at least one discrete area such that it is embedded in the substrate material and/or is applied to the substrate material. Furthermore, it has a second layer having a second electrically conductive material, and a monomolecular layer composed of redox-active bispyridinium molecules, which is arranged between the first layer and the second layer. The bispyridinium molecules are immobilized on the electrically conductive material which is in the form of at least one discrete area, and make electrical contact with the second electrical material of the second layer. Furthermore, electrically inert molecules are immobilized on the first layer, which molecules form a matrix which surrounds the at least one discrete area with the monomolecular layer composed of bispyridinium molecules.