Thermally enhanced electronic module with self-aligning heat sink
US6999317B2 · kind B2 · utility
20Cited by
18References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 12, 2003 |
| Grant date | Feb 14, 2006 |
| Priority date | — |
| Expiry date | Mar 17, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/13055
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A thermally enhanced electronic module includes a thermally conductive case, a self-aligning thermally conductive heat sink and an integrated circuit (IC) package. The case includes an aperture sized for receiving a portion of the heat sink. The IC package includes a first surface and a second surface, opposite the first surface, and is mounted to a substrate with the first surface of the IC package facing the substrate. The second surface of the IC package is in thermal contact with the heat sink, when the heat sink is positioned in the aperture and secured to the case.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.