Patent · US Expired

Seed layer treatment

US7001641B2 · kind B2 · utility

1Cited by

5References

23Claims

0Family size

Assignee

Intel Corporation · US

Inventors

Valery M. Dubin · Portland, US
Christopher D. Thomas · Woodbridge, GB
Vinay Chikarmane · Portland, US

Key dates

Filing date	Sep 23, 2002
Grant date	Feb 21, 2006
Priority date	—
Expiry date	Jun 27, 2023

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/24926
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

Seed layer treatment to remove impurities in the seed layer that might lead to the formation of voids in interconnect circuit features. In one embodiment, the seed layer is heated in a reducing environment. In another embodiment, the seed layer is washed with a surfactant that is compatible with a surfactant used when forming the remainder of the circuit feature on the seed layer. Yet another embodiment combines both techniques.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.