Vinay Chikarmane
16Patents
5h-index
12Co-inventors
63Inventor score
Filing activity: Apr 25, 1997 → Dec 7, 2022
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US7719062B2 | Tuned tensile stress low resistivity slot contact structure for n-type transistor performance enhancement | Electricity | 21 | Active |
| US5804251A | Low temperature aluminum alloy plug technology | Electricity | 16 | Expired |
| US7070687B2 | Apparatus and method of surface treatment for electrolytic and electroless plating of metals in integrated circuit manufacturing | Electricity | 13 | Expired |
| US8120119B2 | Stressed barrier plug slot contact structure for transistor performance enhancement | Electricity | 11 | Active |
| US7968952B2 | Stressed barrier plug slot contact structure for transistor performance enhancement | Electricity | 8 | Active |
| US8278718B2 | Stressed barrier plug slot contact structure for transistor performance enhancement | Electricity | 5 | Active |
| US7525197B2 | Barrier process/structure for transistor trench contact applications | Electricity | 3 | Active |
| US10777655B2 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Electricity | 3 | Active |
| US7371311B2 | Modified electroplating solution components in a low-acid electrolyte solution | Chemistry; Metallurgy | 3 | Expired |
| US7001641B2 | Seed layer treatment | Emerging Cross-Sectional Technologies | 1 | Expired |
| US7768126B2 | Barrier formation and structure to use in semiconductor devices | Electricity | 1 | Active |
| US7741219B2 | Method for manufacturing a semiconductor device using the self aligned contact (SAC) process flow for semiconductor devices with aluminum metal gates | Electricity | 1 | Active |
| US11581419B2 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Electricity | 1 | Active |
| US10854731B2 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Electricity | 1 | Active |
| US11955534B2 | Heterogeneous metal line compositions for advanced integrated circuit structure fabrication | Electricity | 0 | Active |
| US7582558B2 | Reducing corrosion in copper damascene processes | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.