Ultrasonic transducer assembly
US7002283B2 · kind B2 · utility
45Cited by
10References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 3, 2003 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Aug 20, 2023 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention provides an ultrasonic transducer assembly for a bonding apparatus, comprising a bonding tool mounted to an amplifying horn secured between first and second ultrasonic-generating means. A method of forming a transducer for a bonding apparatus is also provided, comprising the steps of providing an amplifying horn, securing first and second ultrasonic-generating means to the amplifying horn such that the amplifying horn is located between said first and second ultrasonic-generating means and mounting a bonding tool to the amplifying horn.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.