Vacuum-cavity MEMS resonator
US7002436B2 · kind B2 · utility
53Cited by
6References
18Claims
0Family size
Assignee
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Key dates
| Filing date | Aug 19, 2004 |
| Grant date | Feb 21, 2006 |
| Priority date | — |
| Expiry date | Aug 19, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH03H2009/02511
- WIPO fieldBasic communication processes
- WIPO sectorElectrical engineering
Abstract
A microelectromechanical (MEMS) resonator with a vacuum-cavity is fabricated using polysilicon-enabled release methods. A vacuum-cavity surrounding the MEMS beam is formed by removing release material that surrounds the beam and sealing the resulting cavity under vacuum by depositing a layer of nitride over the structure. The vacuum-cavity MEMS resonators have cantilever beams, bridge beams or breathing-bar beams.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.