Method for determining optimum bond parameters when bonding with a wire bonder
US7004372B2 · kind B2 · utility
2Cited by
9References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 16, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jan 30, 2024 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01075
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A predetermined number of bond cycles is carried out in order to find optimum bond parameters for a wire bonder. The bond parameters to be optimized are each varied within a predefined range. With each bond cycle, after attachment of the wire to the connection point, the capillary is moved out of the bond position in a predetermined horizontal direction whereby the current flowing through the drive which moves the capillary is monitored and its maximum determined.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.