Chemical mechanical polishing and pad dressing method
US7004822B2 · kind B2 · utility
7Cited by
6References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 28, 2003 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | May 28, 2023 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B37/042
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
The invention provides a chemical mechanical polishing and pad dressing method based on differing the rotational of a pad dresser, head, and/or polishing pad to improve center removal slow profiling.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.