Method and apparatus for shielding integrated circuits
US7005323B2 · kind B2 · utility
1Cited by
7References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 16, 2005 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jun 16, 2025 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3025
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
Some embodiments of the invention cover the top of a flip chip IC with a conductive adhesive material. This material is used in place of a shielding metal can or plate in some embodiments, while it is used in conjunction with such metal can or plate in other embodiments of the invention. Also, some embodiments use a printing technique to coat the top of the flip chip with the conductive adhesive material. In some embodiments, the coating material is a silver paste.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.