Device packaging using tape automated bonding (TAB) strip bonded to strip carrier frame
US7005729B2 · kind B2 · utility
1Cited by
4References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 24, 2002 |
| Grant date | Feb 28, 2006 |
| Priority date | — |
| Expiry date | Jun 29, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In one embodiment of the invention, a die is bonded on a strip carrier frame having a carrier alignment landmark. A tape automated bonding (TAB) strip having a TAB alignment landmark is aligned with the strip carrier frame. The TAB strip is bonded to the strip carrier frame to form a bonded unit.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.